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Product Overview

1. Product Introduction

SpacemiT® Key Stone™ K1 is a high-performance and ultra low-power SOC that integrates Octa RISC-V CPU cores with SpacemiT® Daoyi™ AI computing power deployment. K1 has the following features:

  • Integrates SpacemiT® self-innovate X60™ RISC-V processor core which adheres to the RISC-V 64GCVB architecture and RVA22 standard.
  • Extends 2.0TOPS AI computing power by exploring RISC-V customized instructions to realize CPU AI fusion computing power, and mainstream AI inference frameworks such as TensorFlow Lite, TensorFlow, and ONNX RunTime are supported.
  • Achieves ultra low power consumption by implementing different granularities of power islands and various levels of power states to make K1 more competitive and the leading edge.
  • Supports full-feature interfaces to enrich more innovatative applications and products.
  • Compatible with mainstream OS to meet the needs of various application scenarios.
  • Meets Industrial grade reliability standards front

2. Feature Overview

Application Processor

  • RISC-V SpacemiT® X60™ Dual-Cluster Octa-core processors
  • Adhere to the RISC-V 64GCVB architecture and RVA22 standard
  • Cluster0
    • Quad-Core with 2.0TOPS AI-Power
    • 32K L1-Cache per core
    • 512K L2-Cache
    • 512KB TCM
    • Vector-256bit
  • Cluster1
    • Quad-Core
    • 32K L1-Cache per core
    • 512K L2-Cache
    • Vector-256bit
  • DVFS with adaptive operating voltage from 0.6V to 1.05V DDR Memory
  • Dual chip select 32-bit LPDDR4/LPDDR4x SDRAM with 2666Mbps operation and a total of up to 16GB of RAM
  • Dual chip select 32-bit LPDDR3 SDRAM with 1866Mbps operation and a total of up to 4GB of RAM RCPU(Real-Time CPU)
  • R-I2C (×1)
  • R-I2S (×2)
  • R-UART (×2)
  • R-CAN_FD (×1)
  • R-IR_RX (×1)
  • R-PWM (×10)
  • R-SPI (×1) Peripheral Controller
  • GPIO (×128)
    • 128 pins
    • Pull-up/pull-down programmable
    • 104x 1.8V IO8
    • 24x 1.8V/3.3V IO
  • UART (×10)
    • AP/BT/print
  • I2C (×10)
    • for camera, G-Sensor/ E-COMPASS/ Proximit-Sensor/ Light-Sensor/Gyro and Fingerprint/NFC, PMIC, touch etc.
    • 8x AP_I2C(AP I2C0/1/7 only for camera)+1x HDMI I2C+1x PWR I2C
  • SPI (×4)
    • To support both master and slave mode
    • For IMU, codec etc.
    • Platform has 4 SPI (1x QSPI, 1x SPI LCD, 2x SPI)
  • USB (×3)
    • USB 2.0 OTG
    • USB 2.0 Host
    • USB 3.0 (combo PCIE PortA)
  • PCIE (×3)
    • PCIE PortA Gen2x1
    • PCIE PortB Gen2x2
    • PCIE PortC Gen2x2
  • GMAC (×2)
    • 10/100/1000 Mbps
    • RGMII
  • SDIO (×1 for WIFI)
    • compatible for 4-bit SDIO 3.0 UHS-I protocol, up to SDR104 (208MHz)
  • SD (×1 for TF card)
    • compatible for 4-bit SD 3.0 UHS-I protocol, up to SDR104 (208MHz)
  • eMMC (×1)
    • compatible for 8bit eMMC5.1, up to HS400 (200MHz)
  • MIPI CSI (CSI-2 v1.1) 4 lane(×2)
    • 4 Lane + 4 Lane mode
    • 4 Lane + 2 Lane mode
    • 4 Lane + 2 Lane + 2 Lane mode (triple sensor)
  • MIPI DSI (DSI v1.1) (×1)
    • 4 Lane DSI
  • PWM (×20)
  • CAN-FD (×1)
  • IR-RX (×1) Security System
  • RISC-V PMP Security
  • Secure Boot
  • Secure eFuse 4K bits
  • Cryptographic engine (TRNG/AES/SM2/SM3/SM4/RSA/ECC/SHA2/HMAC) Debug System
  • Two JTAGs for both CPU and MCU subsystem
  • UARTs
  • CPU/IO register snapshot after watchdog reboot Boot System
  • Initial AP boot from SPI-Nand/SPI-NorFlash/eMMC/SD
  • 128KB boot-ROM size Aided System
  • Watchdog design for each CPU/MCU subsystem Multimedia Features GPU
  • IMG BXE-2-32@819MHz, 32KB SLC
  • Support OpenCL3.0/OpenGL ES 3.2/Vulkan1.3 VPU (video processing unit)
  • H.265/H.264/VP8/VP9/MPEG4/MPEG2 decoder 4K@60fps
  • H.265/H.264/VP8/VP9 encoder 4K@30fps
  • Support simultaneously processing encoding 1080P@60fps and decoding 1080P@60fps
  • Support simultaneously processing H264/H265 encoding 1080P@30fps and H264/H265 decoding 4K@30fps Display
  • 1 MIPI DSI-4lane or SPI interface
  • Support up to HD + (1920x1080@60fps)
  • Support up to 4-full-size-layer composer and maximum 8 layer composer by up-down layer reuse in rdma channel
  • Support cmdlist mechanism, which can configure register parameters by HW
  • Support concurrent write back, with both raw and afbc format, also support dither/crop/rotation in write back path
  • Support advanced mmu (virtual address) mechanism, with nearly no page missing in 90/270 degree rotation
  • Support color key and solid color
  • Support both advanced error diffusion and pattern based dither for panel
  • Support both afbc/raw format image source
  • Color saturation/contrast enhancement
  • Support both video mode and cmd mode for panel
  • Support ddr frequency dynamic changing with embedded dfc buffer HDMI 1.4 Camera
  • Dual-ISP
    • 16M (max.) 30fps Dual ISP
    • One 4 Lane CSI + one 4 Lane CSI or 4 Lane + 2 lane + 2 lane
    • RAW sensor, output YUV data to DRAM
    • Hardware JPEG encoder(hardware, up to 23M is supported)
    • Support YUV/EXIF/JFIF format
    • AF/AE/AWB
    • Face detection
    • Digital zoom, panorama view
    • PDAF
    • PIP (picture in picture)
    • Continuous video AF
    • HW 3D denoise Audio
  • Integrated high quality audio codec and audio front-end
  • ADC: 90dB SNR@20~20kHz
  • DAC: 95dB SNR@20~20kHz
  • Class-G: 95dB SNR@20~20kHz, 31mW@32-ohm, THD -90dB
  • ClassAB: 95dB SNR@20~20kHz, 75mW@32-ohm, THD-90dB
  • Line-out to support external Class-D audio amplifier (Class-D in PMIC: 95dB SNR@20 ~ 20kHz, 1W@4.2Vbat 10%THD + N, 8-ohm speaker)
  • Three MICs input
  • Stereo inputs path for noise cancellation
  • Stereo headphone output
  • Audio content sampling rates: 8kHz to 48kHz
  • Microphone bias for headphone plug-in and hook-key detection
  • Quad vocoders for adaptive multi-rate (AMR)
  • Noise suppression and echo cancellation General
  • Operation temperature: -40 ~ 85°C

3. Block Diagram

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